• 专利附录
  • 专利说明
  • 权利要求
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  • 法律状态
  • 优先权
    • 专利摘要:
    "Panel, and method of forming a panel" a panel includes a substrate and an electrothermal layer disposed on the substrate. a thermally conductive and electrically insulating top layer is disposed on the electrothermal layer. the top layer, the electrothermal layer and the substrate can all be printed layers. the electrothermal layer may be a first electrothermal layer and the upper layer may be a first upper layer, wherein at least one additional electrothermal layer and at least one additional upper layer are disposed on the first upper layer, wherein the electrothermal and upper layers are. arranged in an alternate order.
    公开号:BR102017023501A2
    申请号:R102017023501-7
    申请日:2017-10-31
    公开日:2018-06-19
    发明作者:Dardona Sameh；J. Paholsky Richard；Sheedy Paul；Piech Marcin；R. Schmidt Wayde
    申请人:Goodrich Corporation；
    IPC主号:
    专利说明:

    (54) Title: PANEL, E, METHOD FOR
    TRAINING OF A PANEL (51) Int. Cl .: B64D 15/12; H05B 3/12 (30) Unionist Priority: 11/01/2016 US 15/340272 (73) Holder (s): GOODRICH CORPORATION (72) Inventor (s): SAMEH DARDONA; RICHARD J. PAHOLSKY; PAULSHEEDY; MARCIN PIECH; WAYDE R. SCHMIDT (74) Attorney (s): KASZNAR LEONARDOS INTELLECTUAL PROPERTY (57) Summary: PANEL, E, METHOD FOR FORMING A PANEL A panel includes a substrate and an electrothermal layer arranged on the substrate. A thermally conductive and electrically insulating top layer is arranged on the electrothermal layer. The top layer, the electrothermal layer and the substrate can all be printed layers. The electrothermal layer can be a first electrothermal layer and the top layer can be a first upper layer, where at least one additional electrothermal layer and at least one additional upper layer are arranged in the first upper layer, where the electrothermal and upper layers are arranged in an alternating order.
    100- ^
    / 9 “PANEL, E, METHOD FOR FORMING A PANEL”
    BACKGROUND OF THE INVENTION
    1. Field of the Invention [001] The present disclosure refers to heating panels, and more particularly to multilayer defrost / heating floor panels, such as used in aerospace applications.
    2. Description of the Related State of the Art [002] Heating circuits are used in electrothermal panels for defrost and frost protection systems, and the like. The heating circuits are typically made by photochemical etching of alloy sheets onto a substrate and subsequently incorporated into composites of an electrothermal heater, for example, in which the sheets are attached to the substrates prior to engraving. The limitations of these manufacturing methods include repeatability, due to over- or under-recording, photosensitive alignment problems, photosensitive delamination, and poor adhesion to the substrate. These conventional processes require time and labor intensive and require special measures to manage the associated chemical waste.
    [003] Conventional techniques were considered satisfactory for their intended purpose. However, there is an ever-present need for improved heating circuits and methods for doing the same. This disclosure provides a solution to this problem.
    SUMMARY OF THE INVENTION [004] A panel includes a substrate and an electrothermal layer disposed on the substrate. A thermally conductive and electrically insulating top layer is arranged on the electrothermal layer. The top layer, the electrothermal layer and the substrate can all be printed layers. The electrothermal layer can be a first electrothermal layer and the top layer can be a first top layer, where at least one
    Petition 870170083869, of 10/31/2017, p. 10/25 / 9 additional electrothermal layer and at least one additional upper layer are disposed in the first upper layer, in which the electrothermal and upper layers are arranged in an alternating order. The panel can be a defrost panel, for example.
    [005] The substrate may include an adhesive layer configured to adhere to a component to heat the component. It is also contemplated that the substrate can be incorporated into a component to heat the component. The substrate can include at least one of a thermoplastic material or a thermoset material with a lower thermal conductivity than the electrothermal layer. The substrate can include at least one additive for structural properties and / or to attenuate residual stresses and distortions. The at least one additive can be printed or pre-mixed on the substrate.
    [006] The electrothermal layer can be printed on the substrate. The electrothermal layer may include a metal-based or metal-based paint, including at least one of Ag, Cu, NiCr (Nicromo) or CuCr and / or non-metallic electrical conductors, such as carbon inks, carbon nanotubes, carbon nanofibers, graphene or any other suitable carbonaceous material. It is also contemplated that any material or materials of appropriate positive temperature coefficient (PTC) can be used in the electrothermal layer. Other exemplary materials for the electrothermal layer include MoSi2, SiC, Pt, W, LaCnOi. FeCrAl, CuNi, NiFe, NiCrFe, or any other suitable material. The electrothermal layer may include a pattern with redundant electrical current paths.
    [007] The upper layer may have a higher thermal conductivity and less electrical conductivity than the electrothermal layer. The upper layer can seal the electrothermal layer. The top layer can include at least one among diamond, boron nitride, aluminum nitride, silicon carbide, as well as metal oxides based on vanadium, tantalum, aluminum,
    Petition 870170083869, of 10/31/2017, p. 11/25 / 9 magnesium, zinc and the like, as well as combinations of these or any other suitable material. The top layer can be printed on the electrothermal layer and / or on the substrate.
    [008] A method for forming a panel includes printing an electrothermal layer on a substrate and printing an upper layer on the electrothermal layer and / or on the substrate, where the upper layer has higher thermal conductivity and less conductivity electrical than the electrothermal layer. The substrate can be printed on a base substrate.
    [009] These and other characteristics of the systems and methods of disclosing the object will become more easily evident to those versed in the technique from the following detailed description of the preferred modalities taken in conjunction with the figures.
    BRIEF DESCRIPTION OF THE FIGURES [0010] So that those skilled in the technique to which the disclosure in question belongs, readily understand how to manufacture and use the devices and methods of the disclosure in question without undue experimentation, preferred modalities of the same will be described in detail below, in this document , with reference to certain figures, in which:
    Fig. 1 is a schematic top view in cross-section of an exemplary embodiment of a panel constructed in accordance with the present description, showing the substrate, the electrothermal layer and the upper layer;
    Fig. 2 is a schematic top view in cross-section of the panel of Fig. 1, showing optional electrothermal layers and alternating top layers;
    Fig. 3 is a plan view of a portion of the panel of Fig. 1, showing the electrothermal layer printed on the substrate before the upper layer is arranged on it;
    Petition 870170083869, of 10/31/2017, p. 12/25 / 9
    Fig. 4 is a graph showing temperatures as a function of the position on the panel in Fig. 1 without the top layer on it; and
    Fig. 5 is a graph showing temperatures as a function of the position on the panel in Fig. 1 with the top layer on it.
    DETAILED DESCRIPTION OF THE PREFERENTIAL MODALITIES [0011] Reference will now be made to the figures in which the reference numerals identify similar structural attributes or aspects of the disclosure in question. For purposes of explanation and illustration, not limitation, a partial view of an exemplary panel modality according to the description is shown in Fig. 1 and is generally designated by reference number 100. Other panel modalities according to the description, or aspects of these, are provided in Figs. 2-5, as will be described. The systems and methods described in this document can be used to improve the temperature distribution and the general performance of the defrost, anti-frost and heating panels in relation to conventional arrangements.
    [0012] This disclosure describes how direct engraving methods, such as, for example, aerosol printing, plasma spray, thermal metallization, extrusion, screen printing, ultrasonic distribution, atomic layer of the selected area or chemical vapor deposition, or similar, they can be used to directly print the electronic and thermal components of the heating panel circuits on the desired substrate or part to overcome many of the limitations associated with conventional techniques, such as photochemical engraving. Limitations in conventional techniques, such as embossing foils, include limited batch manufacturing and the environmental measures necessary to deal with the resulting waste. In the methods described in this document, multilayers of electromechanical metals,
    Petition 870170083869, of 10/31/2017, p. 13/25 / 9 thermally conductive and thermally conductive insulators can be printed on insulating substrates to form the heating circuits. [0013] A panel 100 includes a substrate 102 and an electrothermal layer 104 disposed on substrate 102. A thermally conductive and electrically insulating top layer 106 is disposed on electrothermal layer 104 and / or substrate 102, that is, the upper layer 106 is deposited in the electrothermal layer 104 and, where there are holes in the electrothermal layer 104, the upper layer is deposited directly on the substrate 102. The upper layer 106, the electrothermal layer 104 and the substrate 102 can all be printed layers. As shown in Fig. 2, the electrothermal layer 104 can be a first electrothermal layer and the top layer 106 can be a first upper layer, wherein at least one additional electrothermal layer 104 and at least one additional upper layer 106 are arranged in the first upper layer 106, in which the electrothermal and upper layers 104 and 106 are arranged in an alternating order. The ellipses in Fig. 2 indicate that the pattern of electrothermal layers 104 and upper layers 106 can be repeated for as many layers as are suitable for a given application.
    [0014] The substrate can include an optional adhesive base layer
    108 configured to adhere to a component to heat, manipulate or otherwise process the component. It is also contemplated that substrate 102 can be incorporated directly into a component, so that the component serves as the base layer 108, for example, by printing substrate 102 directly on an aircraft panel or the like, to heat, handle or process the component in another way. Substrate 102 can include at least one of a thermoplastic material or a thermoset material with a thermal conductivity lower than that of the electrothermal layer 104. This thermal resistance provided by substrate 102 removes heat from the panel or substrate 102
    Petition 870170083869, of 10/31/2017, p. 14/25 / 9 through the top layer 106 for effective heating or defrosting or other need for thermal management. Substrate 102 may include at least one additive for structural properties and / or to attenuate residual stresses and distortions. The at least one additive can be printed or pre-mixed on the substrate. Additives that are electrically insulating and thermally conductive, such as boron nitride, aluminum oxide, aluminum nitride and the like, can be used in this step to control the thermal conductivity of the printed substrate. Thermally conductive and electrically conductive additives include conductive sheets or flakes of graphene, carbon nanofibers, diamond particles or the like, and these can also be added to substrate 102. It is also contemplated that additives such as glass and ceramic powders can be used in this step to improve the structural properties of the substrate and mitigate residual stresses and distortions. The additives can be pre-mixed with the printable material formulations to form the substrate or they can be sprayed on the substrate in situ, using a deposition head, for example. Options include using the substrate layer 102 as formed based on the desired / customized properties, as well as a layer of additives deposited separately on a base layer such as, for example, base substrate 108.
    [0015] The spatial design of the substrate 102 can be optimized to reduce the weight in consideration of the carbon footprint of the circuit, that is, the pattern of the electrothermal layer 104 described below, while ensuring sufficient structural integrity. As such, the design of the substrate 102 can be derived from the design of the electrothermal layer 104 for optimization of the topology.
    [0016] The electrothermal layer 104 can be printed on the substrate
    102. Any other suitable direct engraving technique can be used for the printing operations described in this document. The electrothermal layer
    Petition 870170083869, of 10/31/2017, p. 15/25 / 9
    104 may include a paint based on metal or metal alloy, including at least one of Ag, Cu, NiCr (Nicromo) or CuCr and / or non-metallic electrical conductors, such as carbon inks, carbon nanotubes, nanofibers of carbon, graphene or any other suitable carbonaceous material. It is also contemplated that any material or materials of appropriate positive temperature coefficient (PTC) can be used in the electrothermal layer. Other exemplary materials for the electrothermal layer include MoSi2, SiC, Pt, W, LaCr2O4, FeCrAl, CuNi, NiFe, NiCrFe, or any other suitable material. The ink can optionally be cured, for example, with applied directed energy, such as ultraviolet irradiation, a thermal curing step, laser, plasma or the like, and / or with atmospheric exposure. The electrothermal layer 104 can include a pattern with redundant electrical current paths as shown in Fig. 3 in which the upper layer 106 is removed to show the redundant electrical current paths. Such highly redundant current paths ensure that any local damage does not eliminate heating or thermal management of a significant area of the defrost / heating system.
    [0017] With reference again to Fig. 1, the upper layer 106 has a higher thermal conductivity and less electrical conductivity than the electrothermal layer 104. This upper layer 106 can be optimized for weight reduction while still providing structural integrity, sealing and / or environmental protection of the electrothermal layer 104, and uniform temperature distribution on the upper surface. The top layer 106 may include at least one among diamond, boron nitride, aluminum nitride, silicon carbide, as well as metal oxides based on vanadium, tantalum, aluminum, magnesium, zinc and the like, as well as combinations thereof or any another suitable material to provide these electrical and thermal properties. Additional additives with high
    Petition 870170083869, of 10/31/2017, p. 16/25 / 9 thermal conductivity can be added to the material of the upper layer 106. The upper layer 106 seals the electrothermal layer 104. This provides electrical insulation to prevent electrical short circuit of the electrothermal layer 104, and thermal conduction for temperature distribution of more uniformly than without top layer 106. Fig. 4 shows the temperature variation in a range of positions on panel 100 without top layer 106 where the temperature scale varies in arbitrary units X to Y, and where the position varies in arbitrary units from W to Z. Fig. 5, by comparison, shows the temperature variation in the same position range with the same temperature scale on the vertical axis as in Fig. 4. As can be seen by comparing the Figs. 4 and 5, the temperature varies considerably less in the presence of the upper layer 106, whose thermal conductivity helps to balance the temperature variation by a factor of about three. The top layer 106 is therefore multifunctional - it is electrically insulating and thermally conductive to reduce temperature variations and mitigate the risks of fatigue / failure of the heating element (provides heat to unheated areas based on the thermal conductivity in the plane).
    [0018] A method for forming a panel, for example, panel 100, includes printing an electrothermal layer, such as electrothermal layer 104, on a substrate, such as substrate 102, and printing a layer upper layer, for example, the upper layer 106, in the electrothermal layer and / or on the substrate, where the upper layer has greater thermal conductivity and less electrical conductivity than the electrothermal layer. The substrate can be printed on a base substrate, for example, base substrate 108 or directly on a component, such as an aircraft panel.
    [0019] The modalities described in this document can provide the potential benefits of providing heated parts in low light with
    Petition 870170083869, of 10/31/2017, p. 17/25 / 9 precisely constructed thermal and electrical properties that can increase heating efficiency and mitigate the risks of failure in electrothermal elements. The additional potential benefits of panels as disclosed in modalities in this specification include the manufacture of low-cost layered additives for defrosting / heating floor panels, suitability for fabricating large area structures, the ability to control layer properties for optimal performance , optimized topology design that results in significantly smaller weight and size, low cost production due to the potential to use R2R (roll-to-roll) and robot-controlled processes suitable for automated manufacturing, such as high volume sheet metal operations and roll, reduced weight compared to conventional techniques, including the elimination of hazardous chemical waste products, since only the necessary materials are used during manufacture and reformulation / disposal are minimized, and multifunctional layers to improve efficiency / integrity of the device and reduce the weight in relation to conventional arrangements.
    [0020] The methods and systems of the present description, as described above and shown in the drawings, provide defrost / heating panels with superior properties, including an improved temperature distribution and a better manufacturing productivity compared to conventional arrangements. Although the apparatus and methods of the disclosure in question have been shown and described with reference to preferred embodiments, those skilled in the art will readily appreciate that changes and / or modifications can be made to them without departing from the scope of the disclosure in question.
    Petition 870170083869, of 10/31/2017, p. 18/25 / 3
    权利要求:
    Claims (18)
    [1]
    1. Panel, characterized by the fact that it comprises: a substrate;
    an electrothermal layer arranged on the substrate; and a thermally conductive and electrically insulating top layer disposed in the electrothermal layer.
    [2]
    2. Panel according to claim 1, characterized in that the electrothermal layer is a first electrothermal layer and the upper layer is a first upper layer, in which at least one additional electrothermal layer and at least one additional upper layer are arranged in the first upper layer, in which the electrothermal and upper layers are arranged in an alternating order.
    [3]
    Panel according to claim 1, characterized by the fact that the substrate includes an adhesive layer configured to adhere to a component to heat the component.
    [4]
    4. Panel according to claim 1, characterized by the fact that the substrate is incorporated into a component to heat the component.
    [5]
    Panel according to claim 1, characterized by the fact that the substrate includes at least one of a thermoplastic material or a thermoset material with a thermal conductivity lower than that of the electrothermal layer.
    [6]
    6. Panel according to claim 1, characterized by the fact that the substrate includes at least one additive for structural properties and / or to attenuate residual stress and distortion.
    [7]
    7. Panel according to claim 6, characterized in that the at least one additive is printed or premixed on the substrate.
    [8]
    8. Panel according to claim 1, characterized by the fact that the upper layer has a higher thermal conductivity and a
    Petition 870170083869, of 10/31/2017, p. 19/25
    2/3 electrical conductivity lower than the electrothermal layer.
    [9]
    9. Panel according to claim 1, characterized by the fact that the electrothermal layer is printed on the substrate.
    [10]
    10. Panel according to claim 9, characterized by the fact that the electrothermal layer includes at least one of a paint based on metal or metal alloy that includes at least one of Ag, Cu, NiCr (Nicromo) or CuCr, a non-metallic conductive electrical device that includes at least one of the inks with carbon, carbon nanotubes, carbon nanofibers or graphene, a material or materials with a positive temperature coefficient (PTC) and / or other materials that include at least one among MoSi2 , SiC, Pt, W, LaCr2O4, FeCrAl, CuNi, NiFe or NiCrFe.
    [11]
    11. Panel according to claim 1, characterized by the fact that the electrothermal layer includes a pattern with redundant electrical current paths.
    [12]
    12. Panel according to claim 1, characterized by the fact that the upper layer protects the electrothermal layer.
    [13]
    13. Panel according to claim 1, characterized by the fact that the top layer includes at least one among diamond, boron nitride, aluminum nitride, silicon carbide and / or an oxide based on vanadium, tantalum, aluminum, magnesium and / or zinc.
    [14]
    14. Panel according to claim 1, characterized by the fact that the upper layer is printed on the electrothermal layer and / or on the substrate.
    [15]
    15. Panel according to claim 1, characterized by the fact that the top layer, electrothermal layer and substrate are all printed layers.
    [16]
    16. Panel according to claim 1, characterized by the fact that the panel is a defrost panel.
    [17]
    17. Method for forming a panel, characterized by
    Petition 870170083869, of 10/31/2017, p. 20/25
    3/3 fact that comprises:
    printing an electrothermal layer on a substrate; and printing an upper layer on the electrothermal layer and / or on the substrate, where the upper layer has a higher thermal conductivity and less electrical conductivity than the electrothermal layer.
    [18]
    18. Method according to claim 17, characterized in that it further comprises printing the substrate on a base substrate.
    Petition 870170083869, of 10/31/2017, p. 21/25
    1/3
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    引用文献:
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    US9193466B2|2012-07-13|2015-11-24|Mra Systems, Inc.|Aircraft ice protection system and method|
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    CN110996411A|2019-12-06|2020-04-10|武汉新能源研究院有限公司|Graphene modified inorganic non-metal thick film heating material and preparation method thereof|
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    法律状态:
    2018-06-19| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|
    2021-08-24| B08F| Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]|Free format text: REFERENTE A 4A ANUIDADE. |
    2021-12-14| B08K| Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]|Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2642 DE 24-08-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
    优先权:
    申请号 | 申请日 | 专利标题
    US15/340,272|US20180124874A1|2016-11-01|2016-11-01|Multilayered panels|
    US15/340272|2016-11-01|
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